Author:
Bajwa Adeel Ahmad,Wilde Jürgen
Funder
Fritz Hüttinger Foundation
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference32 articles.
1. Reliability of SiC power devices and its influence on their commercialization — review, status, and remaining issues;Treu,2010
2. Die attach materials for high temperature applications: a review;Manikam;IEEE Trans. Components Packag. Manuf. Technol.,2011
3. A review on die attach materials for SiC-based high-temperature power devices;Chin;Metall. Mater. Trans. B Process Metall. Mater. Process. Sci.,2010
4. Die-attachment technologies for high-temperature applications of Si and SiC-based power devices;Bajwa,2015
5. Processing and characterization of nanosilver pastes for die-attaching SiC devices;Bai;IEEE Trans. Electron. Packag. Manuf.,2007
Cited by
31 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献