Mechanical properties of Sn-58 wt%Bi solder containing Ag-decorated MWCNT with thermal aging tests-Reference-Cited by-同舟云学术

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Mechanical properties of Sn-58 wt%Bi solder containing Ag-decorated MWCNT with thermal aging tests

Published:2020-04 Issue: Volume:820 Page:153077
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Lee Choong-Jae,Min Kyung Deuk,Park Hyun Joon,Jung Seung-Boo^ORCID

Funder

Human Resources Program in Energy Technology

Korea Institute of Energy Technology Evaluation and Planning

Ministry of Trade, Industry & Energy, Republic of Korea

Ministry of Trade, Industry, and Energy (MOTIE), Korea

Regional Specialized Industry Development Program

Korea Institute for Advancement of Technology

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference35 articles.

1. Improvement on the microstructure stability, mechanical and wetting properties of Sn–Ag–Cu lead-free solder with the addition of rare earth elements;Yu;J. Alloy. Comp.,2004

2. Advances in lead-free electronics soldering;Suganuma;Curr. Opin. Solid Mater. Sci.,2001

3. Wetting reaction versus solid state aging of eutectic SnPb on Cu;Tu;J. Appl. Phys.,2001

4. Kirkendall void formation in SnPb eutectic solder joints on bare Cu and its effect on joint reliability;Zeng;J. Appl. Phys.,2005

5. Interfacial reaction and mechanical properties of eutectic Sn–0.7Cu/Ni BGA solder joints during isothermal long-term aging;Yoon;J. Alloy. Comp.,2005

Cited by 35 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. High performance Cu/SAC305 solder low temperature bonding using Ti3C2 MXene interlayer;Materials Letters;2024-10

2. Effect of Ni-RGO nanosheets on the creep behavior of Sn–Ag–Cu composite solder joints;Materials Chemistry and Physics;2024-10

3. Microstructure evolution and deformation behaviour of Sn-xBi-1Ag Solder alloys: Influences of Bi content;Materials Science and Engineering: A;2024-09

4. A contrastive analysis of Sb distribution in Sn-Bi-Sb solder by WDS and EDS;Materials Letters;2024-09

5. Impact of Co on Thermal Aging in Sn58Bi/Cu Solder Joints: IMC Growth and Transformation in Mechanical Properties;Metals and Materials International;2024-05-18

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