High performance Cu/SAC305 solder low temperature bonding using Ti3C2 MXene interlayer
Author:
Funder
Natural Science Foundation of Anhui Province
University Natural Science Research Project of Anhui Province
Publisher
Elsevier BV
Reference15 articles.
1. Life expectancies of Pb-free SAC solder interconnects in electronic hardware
2. Cyclic mechanical behaviour of Sn3.0Ag0.5Cu alloy under high temperature isothermal ageing
3. Effect of silver (Ag) nanoparticle size on the microstructure and mechanical properties of Sn58Bi–Ag composite solders
4. Interfacial reaction, ball shear strength and fracture surface analysis of lead-free solder joints prepared using cobalt nanoparticle doped flux
5. Effect of Cu6Sn5 nanoparticle on thermal behavior, mechanical properties and interfacial reaction of Sn3.0Ag0.5Cu solder alloys
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