Wetting reaction versus solid state aging of eutectic SnPb on Cu-Reference-Cited by-同舟云学术

Wetting reaction versus solid state aging of eutectic SnPb on Cu

Published:2001-05 Issue:9 Volume:89 Page:4843-4849
ISSN:0021-8979
Container-title:Journal of Applied Physics
language:en
Short-container-title:Journal of Applied Physics

Author:

Tu K. N.,Lee T. Y.,Jang J. W.,Li L.,Frear D. R.,Zeng K.,Kivilahti J. K.

Publisher

AIP Publishing

Subject

General Physics and Astronomy

Link

http://aip.scitation.org/doi/pdf/10.1063/1.1357469

Reference25 articles.

1. The effect of Cu6Sn5 whisker precipitates in bulk 60sn-40pb solder

2. The formation of Cu3Sn intermetallic on the reaction of cu with 95Pb-5Sn solder

3. P. W. DeHaven, Electronic Packaging Materials Science, edited by E. A. Geiss, K. N. Tu, and D. R. Uhlmann (MRS ProceedingsMRSPDH, Pittsburgh, PA, 1985), Vol. 40, p. 123.MRSPDH0272-9172

4. Three‐dimensional morphology of a very rough interface formed in the soldering reaction between eutectic SnPb and Cu

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