Revisiting mechanisms to inhibit Ag3Sn plates in Sn–Ag–Cu solders with 1wt.% Zn addition
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference23 articles.
1. The growth and roughness evolution of intermetallic compounds of Sn–Ag–Cu/Cu interface during soldering reaction
2. Mechanical property and fracture behavior characterizations of 96.5 Sn–3.0 Ag–0.5 Cu solder joints
3. The adsorption of Ag3Sn nano-particles on Cu–Sn intermetallic compounds of Sn–3Ag–0.5Cu/Cu during soldering
4. Effects of Ag content on fracture resistance of Sn–Ag–Cu lead-free solders under high-strain rate conditions
5. Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered joints
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3. The Effect of Bi and Zn Additives on Sn-Ag-Cu Lead-Free Solder Alloys for Ag Reduction;Metals;2022-07-25
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5. Influence of bismuth on microstructure, thermal properties, mechanical performance, and interfacial behavior of SAC305-xBi/Cu solder joints;Transactions of Nonferrous Metals Society of China;2021-05
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