Mechanical property and fracture behavior characterizations of 96.5 Sn–3.0 Ag–0.5 Cu solder joints
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference25 articles.
1. Solders in electronics
2. Developing lead-free solders: A challenge and opportunity
3. Lead-free Solders in Microelectronics
4. Metallurgy of low temperature Pb-free solders for electronic assembly
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2. Research on Microstructure and Shear Behavior of Au/Sn-Ag-Cu/Cu Lead-free Solder Joints at Different Soldering Temperatures;Journal of Electronic Materials;2021-07-29
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4. Viscoplastic characterization of novel (Fe, Co, Te)/Bi containing Sn–3.0Ag–0.7Cu lead-free solder alloy;Journal of Materials Science: Materials in Electronics;2020-02-20
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