Finite Element Simulations of Flip Chip Solder Bumps with Fractures Present using FreeFem++
Author:
Affiliation:
1. Harbin Institute of Technology,Dept. of Astronautics Science and Mechanics,Harbin,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873483.pdf?arnumber=9873483
Reference8 articles.
1. Mechanical property and fracture behavior characterizations of 96.5 Sn–3.0 Ag–0.5 Cu solder joints
2. Size and constraint effects on mechanical and fracture behavior of micro-scale Ni/Sn3.0Ag0.5Cu/Ni solder joints
3. New development in freefem++
4. Fracture morphology and mechanism of IMC in Low-Ag SAC Solder/UBM (Ni(P)-Au) for WLCSP
5. Investigation of the Influences of Thermal stresses and Joule Heating within a Piezoresistive MEMS Pressure Sensor using the Finite Element Modeling
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