Investigation of the Influences of Thermal stresses and Joule Heating within a Piezoresistive MEMS Pressure Sensor using the Finite Element Modeling-Reference-Cited by-同舟云学术

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Investigation of the Influences of Thermal stresses and Joule Heating within a Piezoresistive MEMS Pressure Sensor using the Finite Element Modeling

Published:2021-09-14 Issue: Volume: Page:
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Container-title:2021 22nd International Conference on Electronic Packaging Technology (ICEPT)
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Author:

Zhou Chunming,Zhou Peng,Hu Yuehua,Zhang Hao

Funder

National Natural Science Foundation of China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9567715/9567716/09568015.pdf?arnumber=9568015

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