Size and constraint effects on mechanical and fracture behavior of micro-scale Ni/Sn3.0Ag0.5Cu/Ni solder joints-Reference-Cited by-同舟云学术

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Size and constraint effects on mechanical and fracture behavior of micro-scale Ni/Sn3.0Ag0.5Cu/Ni solder joints

Published:2014-11 Issue: Volume:617 Page:14-23
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Qin H.B.,Zhang X.P.,Zhou M.B.,Zeng J.B.,Mai Y.-W.

Funder

Natural Science Foundation of China

Research Fund for Doctoral Program of Higher Education of China

Fundamental Research Fund for Central Universities

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference57 articles.

1. Six cases of reliability study of Pb-free solder joints in electronic packaging technology

2. Effect of volume in interfacial reaction between eutectic Sn–Pb solder and Cu metallization in microelectronic packaging

3. Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy

4. Size and Volume Effects on the Strength of Microscale Lead-Free Solder Joints

5. Solder Volume Effects on the Microstructure Evolution and Shear Fracture Behavior of Ball Grid Array Structure Sn-3.0Ag-0.5Cu Solder Interconnects

Cited by 35 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Influence of temperature gradient bonding on the micromorphology and shear performance of Sn-based solder joints: Experiments and first principles calculations;Journal of Manufacturing Processes;2024-07

2. Research on technology and isothermal aging of double sided module convex interconnect;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05

3. Study of microstructure, growth orientations and shear performance of Cu/Sn-3.0Ag-0.5Cu/Cu solder joints by using thermal gradient bonding;Materials Characterization;2023-09

4. Comparative study of solder size and volume effect on properties of Sn–3.0Ag–0.5Cu joints during isothermal aging;Journal of Materials Science: Materials in Electronics;2023-06

5. A Review of Low-Temperature Solders in Microelectronics Packaging;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-04

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