The adsorption of Ag3Sn nano-particles on Cu–Sn intermetallic compounds of Sn–3Ag–0.5Cu/Cu during soldering
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference26 articles.
1. Microstructural evolution and tensile properties of Sn–Ag–Cu mixed with Sn–Pb solder alloys
2. The microstructure parameters and microhardness of directionally solidified Sn–Ag–Cu eutectic alloy
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4. Preparation of Sn–3.5Ag nano-solder by supernatant process
5. 2009 International Conference on Electronic Packaging Technology & High Density Packaging;Lee,2009
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