Aging induced structural and electrochemical corrosion behaviour of Sn-1.0Ag-0.5Cu and Sn-3.8Ag-0.7Cu solder alloys-Reference-Cited by-同舟云学术

Aging induced structural and electrochemical corrosion behaviour of Sn-1.0Ag-0.5Cu and Sn-3.8Ag-0.7Cu solder alloys

Published:2018-05 Issue: Volume:745 Page:446-454
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Kaushik Raj K.,Batra Uma,Sharma J.D.

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference31 articles.

1. Evaluation of cooling rate on electrochemical behaviour of Sn–0.3Ag–0.9Zn solder alloy in 3.5 wt. % NaCl solution;Wang;J. Mater. Sci. Mater. Electron.,2015

2. P. Cox. and F. Frattini, DIrective 2003/109/EC of the European Parliament and of the Council of 8 December 2003 Amending Directive 2002/96/EC on Waste Electrical and Electronic Equipment (WEEE) Directive, December 8, 2003.

3. Creep behavior of near-peritectic Sn–5Sb solders containing small amount of Ag and Cu;El-Daly;Materials Science and Engineering: A,2011

4. Revisiting mechanisms to inhibit Ag3Sn plates in Sn–Ag–Cu solders with 1wt. % Zn addition;Luo;J. Alloy. Comp.,2010

5. Microstructural stability of Sn–1Ag–0.5 Cu–xAl (x= 1, 1.5, and 2wt. %) solder alloys and the effects of high-temperature aging on their mechanical properties;Sabri;Mater. Char.,2013

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