Effect of thermal-shearing cycling on Ag3Sn microstructural coarsening in SnAgCu solder
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference18 articles.
1. Proceedings of the 4th International Symposium on Electronic Materials and Packaging Conference;Wei,2002
2. Proceedings of the 4th International Symposium on Electronic Materials and Packaging Conference;Chang,2002
3. Microstructure and intermetallic growth effects on shear and fatigue strength of solder joints subjected to thermal cycling aging
4. Dissolution of electroless Ni metallization by lead-free solder alloys
5. Fatigue crack growth behavior of 96.5Sn–3.5Ag lead-free solder
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2. Mechanistic understanding of microstructural effects on the thermal fatigue resistance of solder joints;Journal of the Mechanics and Physics of Solids;2024-06
3. Precipitation processes and phase interface structure of Ag3Sn during solidification of SnAg3Cu0.5/Cu solder joint;Vacuum;2024-01
4. Microstructural evolution of 96.5Sn-3.0Ag-0.5Cu (SAC305) solder joints induced by variation doses of gamma-irradiation;Journal of Materials Science: Materials in Electronics;2023-12-21
5. Finite Element Simulation of Sn-Ag-Cu Solder Joint Reliability Under Thermoelectric Coupling;Journal of Electronic Materials;2023-08-29
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