Finite Element Simulation of Sn-Ag-Cu Solder Joint Reliability Under Thermoelectric Coupling-Reference-Cited by-同舟云学术

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Finite Element Simulation of Sn-Ag-Cu Solder Joint Reliability Under Thermoelectric Coupling

Published:2023-08-29 Issue:11 Volume:52 Page:7512-7524
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:J. Electron. Mater.

Author:

Wang Xianyu,He Liang^ORCID,Chen Hua,Xiao Xiaolei

Funder

National Natural Science Foundation of China

Fundamental Research Funds for the Central Universities

Equipment Pre-Research Project of China

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

https://link.springer.com/content/pdf/10.1007/s11664-023-10660-y.pdf

Reference34 articles.

1. L. Nie, Y. Huang, and M. Liu, Internal defects inspection of TSV 3D package based on thermal distribution analysis. AIP Adv. 11, 085312 (2021).

2. H. Liang, X. He, and B. Xiong, Two-mask wafer-level vacuum packaging with bulk-Si 3D interconnects for MEMS devices and its package performances. IEEE Sens. J. 22, 14522 (2022).

3. M.A. Kabir and Y. Peng, Holistic chiplet-package co-optimization for agile custom 25-D design. IEEE Trans. Compon. Packag. Manufact. Technol. 11, 715 (2021).

4. J.H. Lau, C.T. Ko, T.J. Tseng, K.M. Yang, T.C.Y. Peng, T. Xia, P.B. Lin, E. Lin, L. Chang, H.N. Liu, and D. Cheng, Panel-level chip-scale package with multiple diced wafers. IEEE Trans. Compon. Packag. Manufact.Technol. 10, 1110 (2020).

5. E. George and M. Pecht, RoHS compliance in safety and reliability critical electronics. Microelectron. Reliab. 65, 1 (2016).

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