Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials
Cited by
6 articles.
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1. Finite Element Simulation of Sn-Ag-Cu Solder Joint Reliability Under Thermoelectric Coupling;Journal of Electronic Materials;2023-08-29
2. Application of AI-enabled Simulation in Power Package Development;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17
3. Recent Advances and Trends in Advanced Packaging;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-02
4. An Overview of AI-Assisted Design-on-Simulation Technology for Reliability Life Prediction of Advanced Packaging;Materials;2021-09-16
5. Reliability of 6-Side Molded Panel-Level Chip-Scale Packages (PLCSPs);2021 IEEE 71st Electronic Components and Technology Conference (ECTC);2021-06