Author:
Pang H.L.J,Tan K.H,Shi X.Q,Wang Z.P
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference9 articles.
1. Solder Joint Reliability of BGA, CSP, Flip Chip and Fine Pitch SMT Assemblies;Lau,1997
2. Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy
3. Constitutive relations for tin-based solder joints
4. A modified energy-based low cycle fatigue model for eutectic solder alloy
5. The Role of Microstructure in Thermal Fatigue of Pb–Sn Solder Joint, Solder Joint Reliability: Theory and Applications;Morris,1991
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