Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy-Reference-Cited by-同舟云学术

Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy

Published:1999-09-01 Issue:3 Volume:121 Page:179-185
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Shi X. Q.¹,Zhou W.²,Pang H. L. J.²,Wang Z. P.¹

Affiliation:

1. Gintic Institute of Manufacturing Technology, Nanyang Drive, Sigapore 638075

2. School of Mechanical and Production Engineering, Nanyang Technological University, Nanyang Avenue, Singapore 639798

Abstract

In this study, tensile tests of 63Sn/37Pb solder were carried out at various strain rates from 10−5 s−1 to 10−1 s−1 over a wide temperature range from −40°C to 125°C to study the effect of strain rate and testing temperature on the mechanical properties in a systematic manner. Based on these experimental data, a set of empirical formulae was derived by a statistical method to describe the effect of temperature and strain rate in a quantitative manner and explain the variation in the mechanical properties published in other reports. It is concluded that the empirical formulae can be used to characterize the mechanical properties of 63Sn/37Pb over a wide range of temperatures and strain rates.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/121/3/179/5618201/179_1.pdf

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