Enhanced growth of the Cu6Sn5 phase in the Sn/Ag/Cu and Sn/Cu multilayers subjected to applied strain
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference22 articles.
1. Six cases of reliability study of Pb-free solder joints in electronic packaging technology
2. Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered joints
3. Intermetallic compound formation and morphology evolution in the 95Pb5Sn flip-chip solder joint with Ti/Cu/Ni under bump metallization during reflow soldering
4. Effects of electromigration on interfacial reactions in cast Sn/Cu joints
5. Interfacial reactions in Sn–Sb/Ni couples
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