Studies on SiO2–SiO2 bonding with hydrofluoric acid. Room temperature and low stress bonding technique for MEMS-Reference-Cited by-同舟云学术

Studies on SiO2–SiO2 bonding with hydrofluoric acid. Room temperature and low stress bonding technique for MEMS

Published:2000-02 Issue:3 Volume:79 Page:237-244
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Nakanishi H,Nishimoto T,Nakamura R,Yotsumoto A,Yoshida T,Shoji S

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference8 articles.

1. W.H. Ko, J.T. Sumint, G.J. Yeh, Micro-machining and Micro-packaging for Transducers, Elsevier, 1985.

2. A. Hanneborg, N. Nese, P. Ohlckers, Tech. Dig. Micromechanics Europe, 2nd Workshop on Micromechanics, Berlin, September, 1990.

3. Silicon fusion bonding for fabrication of sensors, actuators and microstructures

4. S. Shoji, M. Esashi, Proc. Micro Total Analysis System Workshop, The Netherlands, November, 1994, pp. 165–179.

5. S. Shoji, H. Kikuchi, H. Torigoe, Proc. of 10th IEEE Micro Electro Mechanical Systems Workshop, Japan, January, 1997, pp. 299–304.

Cited by 63 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Eco‐friendly glass wet etching for MEMS application: A review;Journal of the American Ceramic Society;2024-07-02

2. Silicate glass-to-glass hermetic bonding for encapsulation of next-generation optoelectronics: A review;Materials Today;2021-07

3. Sequential Plasma Activation for Low Temperature Bonding of Aluminosilicate Glass;ECS Journal of Solid State Science and Technology;2021-05-01

4. Demonstration of Low-Temperature Fine-Pitch Cu/SiO₂ Hybrid Bonding by Au Passivation;IEEE Journal of the Electron Devices Society;2021

5. Cold joining of fused silica: Bonding pressure and surface roughness effects;Materials Letters;2021-01