Silicon fusion bonding for fabrication of sensors, actuators and microstructures-Reference-Cited by-同舟云学术

Silicon fusion bonding for fabrication of sensors, actuators and microstructures

Published:1990-04 Issue:1-3 Volume:23 Page:919-926
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Barth Philip W.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference23 articles.

1. Fusion of silicon wafers;Brock;IBM Tech. Discl. Bull.,1977

2. Silicon-on-insulator (SOI) by bonding and etch-back;Lasky;IEDM Tech. Digest Int. Electron Devices Meet., Washington, DC, U.S.A.,1985

3. Simple wafer fusion builds better power chips;Electronics,1985

4. A newly developed silicon to silicon direct adhesion method;Shimbo,1986

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