Sequential Plasma Activation for Low Temperature Bonding of Aluminosilicate Glass
Author:
Publisher
The Electrochemical Society
Subject
Electronic, Optical and Magnetic Materials
Link
https://iopscience.iop.org/article/10.1149/2162-8777/abfd4b/pdf
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4. 300 mm wafer-level hybrid bonding for cu/interlayer dielectric bonding in vacuum;Fujino;Japan. J. Appl. Phys.,2019
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