Silicate glass-to-glass hermetic bonding for encapsulation of next-generation optoelectronics: A review-Reference-Cited by-同舟云学术

Silicate glass-to-glass hermetic bonding for encapsulation of next-generation optoelectronics: A review

Published:2021-07 Issue: Volume:47 Page:131-155
ISSN:1369-7021
Container-title:Materials Today
language:en
Short-container-title:Materials Today

Author:

Granados Laura,Morena Robert,Takamure Noboru,Suga Tadatomo,Huang Shujuan,McKenzie David R.,Ho-Baillie Anita

Funder

Australian Research Council

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference152 articles.

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