Tailored surface chemistry of SiO2 particles with improved rheological, thermal-mechanical and adhesive properties of epoxy based composites for underfill applications-Reference-Cited by-同舟云学术

Tailored surface chemistry of SiO2 particles with improved rheological, thermal-mechanical and adhesive properties of epoxy based composites for underfill applications

Published:2018-11 Issue: Volume:156 Page:111-120
ISSN:0032-3861
Container-title:Polymer
language:en
Short-container-title:Polymer

Author:

Li Gang,He Yachuan,Zhu Pengli,Zhao Tao,Sun Rong,Lu Daniel,Wong Ching-ping

Funder

National Natural Science Foundation of China

National Basic Research Program of China

Youth Talent of Science and Technology

Shenzhen Basic Research Plan

Publisher

Elsevier BV

Subject

Polymers and Plastics,Materials Chemistry,Organic Chemistry

Reference34 articles.

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4. Recent advances in flip-chip underfill: materials, process, and reliability;Zhang;Ieee T. Adv. Packaging,2004

5. Self-patterning of silica/epoxy nanocomposite underfill by tailored hydrophilic-superhydrophobic surfaces for 3D integrated circuit (IC) stacking;Tuan;ACS Appl. Mater. Interfaces,2017

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