Self-Patterning of Silica/Epoxy Nanocomposite Underfill by Tailored Hydrophilic-Superhydrophobic Surfaces for 3D Integrated Circuit (IC) Stacking-Reference-Cited by-同舟云学术

Self-Patterning of Silica/Epoxy Nanocomposite Underfill by Tailored Hydrophilic-Superhydrophobic Surfaces for 3D Integrated Circuit (IC) Stacking

Published:2017-03-02 Issue:10 Volume:9 Page:8437-8442
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Tuan Chia-Chi¹,James Nathan Pataki¹,Lin Ziyin¹,Chen Yun¹²,Liu Yan¹,Moon Kyoung-Sik¹,Li Zhuo³,Wong C. P.¹⁴

Affiliation:

1. School of Materials Science and Engineering, Georgia Institute of Technology, 771 Ferst Drive, Atlanta, Georgia 30332, United States

2. School of Electromechanical Engineering and Key Laboratory of Mechanical Equipment Manufacturing & Control Technology of Ministry of Education, Guangdong University of Technology, Guangzhou 510006, China

3. Department of Materials Science, Fudan University, 220 Handan Road, Shanghai 200433, China

4. Department of Electronic Engineering, The Chinese University of Hong Kong, Shatin, Hong Kong

Funder

Semiconductor Research Corporation

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.6b15771

Reference27 articles.

1. Superhydrophobic-Superhydrophilic Micropatterning: Towards Genome-on-a-Chip Cell Microarrays

2. Laser-treated hydrophobic paper: an inexpensive microfluidic platform

3. Centrifugation-Assisted Fog-Collecting Abilities of Metal-Foam Structures with Different Surface Wettabilities

4. Fabrication of Periodic Nanostructure Assemblies by Interfacial Energy Driven Colloidal Lithography

5. Controlling Wetting and Self-Assembly Dynamics by Tailored Hydrophobic and Oleophobic Surfaces

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