Surface and Buried Interfacial Structures of Epoxy Resins Used as Underfills Studied by Sum Frequency Generation Vibrational Spectroscopy
Author:
Affiliation:
1. Department of Chemistry, University of Michigan, Ann Arbor, Michigan 48109, United States
2. Freescale Semiconductor, Inc., 6501 William Cannon Drive West, Austin, Texas 78735, United States
Publisher
American Chemical Society (ACS)
Subject
General Materials Science
Link
https://pubs.acs.org/doi/pdf/10.1021/am2001899
Reference54 articles.
1. Advanced underfill for high thermal reliability
2. Mechanical Modeling and Characterization of the Curing Process of Underfill Materials
3. Thermal characterization of thermally conductive underfill for a flip-chip package using novel temperature sensing technique
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