1. Cool Chips: Opportunities and Implications for Power and Thermal Management
2. Chip-scale thermal management of high-brightness LED packages
3. Resistance to Thermal Shock and to Oxidation of Metal Diborides?SiC Ceramics for Aerospace Application
4. Brunschwiler, T.; Goicochea, J.; Matsumoto, K.; Wolf, H.; Kümin, C.; Michel, B.; Wunderle, B.; Faust, W.InFormulation of Percolating Thermal Underfill by Sequential Convective Gap Filling, Proceedings of 7th International Conference and Exhibition on Device Packaging, Scottsdale, AZ, Mar 8–11;IMAPS:Washington, DC, 2011, Vol.4, pp229–237.
5. Liang, Q.; Moon, K. S.; Wong, C. P.InHigh Thermal Conductive Underfill Materials for Flip-Chip Application, Proceedings of 2nd IEEE International Interdisciplinary Conference on Portable Information Devices 2008 and the 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics 2008, Garmisch-Partenkirchen, Germany, Aug 17–20;IEEE:New York, 2008, pp162–165.