Particle Packing Theory Guided Thermal Conductive Polymer Preparation and Related Properties
Author:
Affiliation:
1. Research Center of Nanoscience and Nanotechnology, Shanghai University, 99 Shangda Road, Shanghai 200444, People’s Republic of China
Funder
National Natural Science Foundation of China
Shanghai Advanced Composite Materials Design and Manufacturing Professional Technical Service Platform
Publisher
American Chemical Society (ACS)
Subject
General Materials Science
Link
https://pubs.acs.org/doi/pdf/10.1021/acsami.8b10983
Reference59 articles.
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4. Reliability of thermal interface materials: A review
5. Coupled Chiral Structure in Graphene-Based Film for Ultrahigh Thermal Conductivity in Both In-Plane and Through-Plane Directions
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