Author:
Lu Jiawei,Sun Gangwei,Wu Qiao,Cai Yuheng,Liu Tao
Funder
National Natural Science Foundation of China
Reference70 articles.
1. Surface modified hollow glass microspheres-epoxy composites with enhanced thermal insulation and reduced dielectric constant;Yu;Mater. Today Commun.,2022
2. Graphene-based thermoplastic composites as extremely broadband and frequency-dependent EMI absorbers for multifunctional applications;Zeranska;ACS Appl. Electron. Mater.,2022
3. V. Jayaram, V. Mehta, Y. Bai, J.C. Decker, Solutions to overcome warpage and voiding challenges in fanout wafer-level packaging, in: IEEE 72nd Electronic Components and Technology Conference (ECTC), San Diego, May, 2022. pp. 1511-1517. https://doi.org/10.1109/ECTC51906.2022.00241.
4. Analysis and optimization of transient heat dissipation characteristics of high power resistors with a sensible heat storage method;Yu;Appl. Therm. Eng.,2023
5. Cooling of high-power-density microdevices using liquid metal coolants;Miner;Appl. Phys. Lett.,2004