Cooling of high-power-density microdevices using liquid metal coolants-Reference-Cited by-同舟云学术

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Cooling of high-power-density microdevices using liquid metal coolants

Published:2004-07-19 Issue:3 Volume:85 Page:506-508
ISSN:0003-6951
Container-title:Applied Physics Letters
language:en
Short-container-title:Appl. Phys. Lett.

Author:

Miner A.,Ghoshal U.

Publisher

AIP Publishing

Subject

Physics and Astronomy (miscellaneous)

Link

http://aip.scitation.org/doi/pdf/10.1063/1.1772862

Reference14 articles.

1. Proceedings ITherm 2002, Eighth Intersociety Conference On Thermal and Thermo-mechanical Phenomena in Electronic Systems, 2002;Saini A.

2. Assessment of high-heat-flux thermal management schemes

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