A review on coolant selection for thermal management of electronics and implementation of multiple-criteria decision-making approach

Author:

Chakraborty Samarshi,Shukla Digvijay,Kumar Panigrahi Pradipta

Publisher

Elsevier BV

Reference117 articles.

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2. A.J.G. Yunus A. Cengal, Heat and Mass Trasnfer: Fundametals and Applications, Heat and Mass Trasnfer: Fundametals and Applications. 1 (2014) 67–142, 379–424. https://books.google.com/books/about/Heat_and_Mass_Transfer_Fundamentals_and.html?id=B89MnwEACAAJ (accessed June 13, 2023).

3. Introductory chapter: Electronics cooling — An overview;Murshed;Electron. Cooling,2016

4. T.A. Alves, Heat Pipe and Thermosyphon for Thermal Management of Thermoelectric Cooling, in: L. Krambeck (Ed.), IntechOpen, Rijeka, 2018: p. Ch. 17. 10.5772/intechopen.76289.

5. M.H.A. Elnaggar, Heat Pipes for Computer Cooling Applications, in: E.E.E.-S.M.S. Murshed (Ed.), IntechOpen, Rijeka, 2016: p. Ch. 4. 10.5772/62279.

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