Author:
Lee Yoon-Jik,Suh Bong-Seok,Rha Sa-Kyun,Park Chong-Ook
Subject
Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials
Reference12 articles.
1. E.R. Weber, Appl. Phys. A (1983) 1.
2. Multicarrier trapping by copper microprecipitates in silicon
3. Thermal stability of on-chip copper interconnect structures
4. Reactively sputtered TiN as a diffusion barrier between Cu and Si
5. Sa-Kyun Rha, Won-Jun Lee, Seung-Yun Lee, Yong-Sup Hwang, Yoon-Jik Lee, Dong-Il Kim, Dong-Won Kim, Soung-Soon Chun, Chong-Ook Park, Thin Solid Films (1997) submitted.
Cited by
53 articles.
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