Author:
Pala Uygar,Kuster Fredy,Wegener Konrad
Subject
Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modelling and Simulation,Ceramics and Composites
Reference24 articles.
1. Ductile-regime grinding of brittle materials: experimental results and the development of a model;Bifano;Proceedings of SPIE – The International Society for Optical Engineering,1989
2. Ductile-regime grinding – a new technology for machining brittle materials;Bifano;J. Eng. Ind. Trans. ASME,1991
3. Depth of cut per abrasive in fixed diamond wire sawing;Chung;Int. J. Adv. Manuf. Technol.,2015
4. Generation of diamond wire sliced wafer surface based on the distribution of diamond grits;Chung;Int. J. Precis. Eng. Manuf.,2014
5. Abrasive distribution of the fixed diamond wire in wire sawing process;Chung;Adv. Mater. Res.,2012
Cited by
24 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献