An encoder-decoder-based image segmentation method for abrasive height detection of diamond wire
Author:
Funder
National Natural Science Foundation of China
Key Technology Research and Development Program of Shandong
Publisher
Springer Science and Business Media LLC
Link
https://link.springer.com/content/pdf/10.1007/s00170-024-13829-9.pdf
Reference43 articles.
1. Ge M, Zhang C, Wang P, Li Z, Ge P (2020) Modeling of electroplated diamond wire and its application towards precision slicing of semiconductors. J Manuf Process 87:141–149. https://doi.org/10.1016/j.jmapro.2023.01.003
2. Wallburg F, Kuna M, Budnitzki M, Schoenfelder S (2022) A material removal coefficient for diamond wire sawing of silicon. Wear 504:204400. https://doi.org/10.1016/j.wear.2022.204400
3. Wang P, Ge P, Ge M, Bi W, Meng J (2019) Material removal mechanism and crack propagation in single scratch and double scratch tests of single-crystal silicon carbide by abrasives on wire saw. Ceram Int 45(1):384–393. https://doi.org/10.1016/j.ceramint.2018.09.178
4. Gao Y, Ge P, Liu T (2016) Experiment study on electroplated diamond wire saw slicing single-crystal silicon. Mater Sci Semicond Process 56:106–114. https://doi.org/10.1016/j.mssp.2016.08.003
5. Chung C, Le V (2015) Depth of cut per abrasive in fixed diamond wire sawing. Int J Adv Manuf Technol 80(5–8):1337–1346. https://doi.org/10.1007/s00170-015-7089-z
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3