Experiment study on electroplated diamond wire saw slicing single-crystal silicon-Reference-Cited by-同舟云学术

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Experiment study on electroplated diamond wire saw slicing single-crystal silicon

Published:2016-12 Issue: Volume:56 Page:106-114
ISSN:1369-8001
Container-title:Materials Science in Semiconductor Processing
language:en
Short-container-title:Materials Science in Semiconductor Processing

Author:

Gao Yufei,Ge Peiqi,Liu Tengyun

Funder

National Natural Science Foundation of China

Shandong Provincial Natural Science Foundation, China

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference26 articles.

1. A grinding-based manufacturing method for silicon wafers: an experimental investigation;Pei;Int. J. Mach. Tool Manuf.,2005

2. Multi-objective optimization for silicon wafer slicing using wire-EDM process;Dongre;Mater. Sci. Semicond. Process.,2015

3. A study on surface grinding of 300mm silicon wafers;Pei;Int. J. Mach. Tool Manuf.,2002

4. Free abrasive machining in slicing brittle materials with wiresaw;Yang;J. Electron. Packag.,2001

5. Elasto-hydrodynamic interaction in the free abrasive wafer slicing using a wiresaw: modeling and finite element analysis;Bhagavat;ASME J. Tribol.,2000

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2. Efficient manufacture of high-performance electroplated diamond wires utilizing Cr-coated diamond micro-powder;Materials Science in Semiconductor Processing;2024-08

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4. Wire Bow In Situ Measurement for Monitoring the Evolution of Sawing Capability of Diamond Wire Saw during Slicing Sapphire;Materials;2024-05-02

5. Experiment Comparative Analysis of Feed Rate with Velocity Control in Cutting Mono Crystalline Silicon Using a Diamond Wire Saw;Micromachines;2024-03-29

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