Ultrasonic-assisted connection of Cu/Cu structure using Sn58Bi solder enhanced by B4C nanoparticles-Reference-Cited by-同舟云学术

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Ultrasonic-assisted connection of Cu/Cu structure using Sn58Bi solder enhanced by B4C nanoparticles

Published:2023-10 Issue: Volume:319 Page:118062
ISSN:0924-0136
Container-title:Journal of Materials Processing Technology
language:en
Short-container-title:Journal of Materials Processing Technology

Author:

Chen Chen,Zhang Liang,Wang Xi,Lu Xiao,Guo Yong-huan

Funder

Jiangsu Province Department of Science and Technology

Natural Science Foundation of Jiangsu Province

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modeling and Simulation,Ceramics and Composites

Reference38 articles.

1. Effect of Co addition into Ni film on shear strength of solder/Ni/Cu system: experimental and theoretical investigations;Bi;Mater. Sci. Eng. A,2020

2. Interfacial microstructure and mechanical reliability of Sn-58Bi/ENEPIG solder joints;Chen;Processes,2022

3. Review of ultrasonic-assisted soldering in Sn-based solder alloys;Chen;J. Mater. Sci. -Mater. Electron.,2023

4. Mechanical properties and microstructure evolution of Cu/Sn58Bi/Cu solder joint reinforced by B4C nanoparticles;Chen;J. Mater. Res. Technol.,2023

5. Microstructure and properties of Sn58Bi/Ni solder joint modified by Mg particles;Chen;J. Mater. Res. Technol.,2023

Cited by 11 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Ultrarapid soldering Cf/Al by inactive solder by ultrasonic assistance;Journal of Materials Processing Technology;2024-09

2. Nanostructured compliant interconnections for advanced Micro-Electronic packaging;Materials & Design;2024-08

3. Inhibition of intermetallic compounds using pure Ni or Ni–Al2O3 nanocomposite coating during the ultrasonic-assisted soldering of Mg/Al dissimilar metals;Journal of Materials Processing Technology;2024-07

4. Application of Ultrasonic Power in Forming Sn58Bi/Cu Solder Joints with Trace Si3N4 Nanowire Doping;Journal of Materials Engineering and Performance;2024-05-03

5. Strong composite SnAgCu solder joints with internal aligned carbon fibers by magnetic field;Journal of Materials Processing Technology;2024-05

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