Application of Ultrasonic Power in Forming Sn58Bi/Cu Solder Joints with Trace Si3N4 Nanowire Doping
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Publisher
Springer Science and Business Media LLC
Link
https://link.springer.com/content/pdf/10.1007/s11665-024-09514-3.pdf
Reference25 articles.
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3. L. Zhang and S.J. Zhong, Effect of Ni3Sn4 on the Thermo-Mechanical Fatigue Life of Solder Joints in 3D IC, Front. Mater., 2021, 8, 645782.
4. S.J. Zhong, L. Zhang, M.L. Li et al., Development of Lead-Free Interconnection Materials in Electronic Industry During the Past Decades: Structure and Properties, Mater. Des., 2022, 215, 110439.
5. X.Y. Bi, X.W. Hu, and Q.L. Li, Effect of Co Addition into Ni Film on Shear Strength of Solder/Ni/Cu System: Experimental and Theoretical Investigations, Mater. Sci. Eng. A, 2020, 788, 139589.
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