Microstructure and properties of Sn58Bi/Ni solder joint modified by Mg particles
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites
Reference43 articles.
1. Recent advances on SnBi low-temperature solder for electronic interconnections;Jiang;J Mater Sci Mater Electron,2021
2. A comparative study of thermal fatigue life of eutectic Sn-Bi, hybrid Sn-Bi/SAC and SAC solder alloy BGAs;Cai;Microelectron Reliab,2021
3. Ultrasonic-assisted dispersion of ZnO nanoparticles to Sn-Bi solder: a study on microstructure, spreading, and mechanical properties;Rajendran;J Mater Eng Perform,2021
4. Microstructure and mechanical behavior of SnBi-xAg and SnBi-xAg@P-Cu solder joints during isothermal aging;Liu;Microelectron Reliab,2021
5. Shiue Y Y, Chuang T H. Effect of La addition on the interfacial intermetallics and bonding strengths of Sn-58Bi solder joints with Au/Ni/Cu pads. J Alloys Compd, 491(1–2): 610-617.
Cited by 13 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Effect of bonding time on reliability of Cu/Sn-9Zn-30Cu/Cu solder joints for 3D packaging;Journal of Materials Science: Materials in Electronics;2024-07
2. Orthogonal design optimization for Cu/Sn58Bi-0.4Mg/Cu solder joint strength in ultrasonic-assisted soldering;Materials Today Communications;2024-03
3. Cobalt-Graphene NanoSheets enhanced Sn–0.3Ag–0.7Cu composite solder: Study on microstructure, crystal orientation relations and mechanical properties;Materials Science and Engineering: A;2024-03
4. Influence of doping Si3N4 nanoparticles on the properties and microstructure of Sn58Bi solder for connecting Cu substrate;Soldering & Surface Mount Technology;2024-02-15
5. Effect of Sn Plating Thickness on Wettability, Solderability, and Electrical Connections of Electronic Lead Connectors for Surface Mount Technology Applications;Sains Malaysiana;2023-11-30
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3