Effect of bonding time on reliability of Cu/Sn-9Zn-30Cu/Cu solder joints for 3D packaging
Author:
Funder
National Natural Science Foundation of China
Natural Science Foundation of Guangdong Province
Publisher
Springer Science and Business Media LLC
Link
https://link.springer.com/content/pdf/10.1007/s10854-024-13146-7.pdf
Reference37 articles.
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2. Z. Xu, Z. Li, Z. Xu, Z. Ma, S. Chen, X. Liu, J. Yan, Avoiding degradation and increasing joint strength of Al alloys by rapid ultrasonic soldering at low temperature. J. Mater. Process. Technol. 300, 117397 (2022)
3. M. Zhang, Z. Ma, G. Chen, F. Xia, X. Yu, Spreading behavior of molten solder with alternative currents under the action of electromagnetic ultrasound. J Mater Res Technol. 18, 3700 (2022)
4. Z. Liu, X.Y. Wang, L. Yang, L.B. Sun, X.X. Jiao, H.M. Gao, Z.T. Zhang, Y.C. Zhang, Microstructure and shear properties of Sn-xZn transient liquid phase bonding in 3D-Chip stacking packaging. Trans. Indian Inst. Met. 76, 2757 (2023)
5. F. Li, C. Pu, C. Li, J. Yang, Y. Jia, C. Geng, X. Zhang, Q. Bao, S. Guo, J. Yi, J. Zhang, Study on the effects of Ag addition on the mechanical properties and oxidation resistance of Sn-Zn lead-free solder alloy by high-throughput method. J. Mater. Sci-Mater. El. (2023). https://doi.org/10.1007/s10854-022-09756-8
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