Microstructure and Shear properties of Sn–xZn Transient Liquid Phase Bonding in 3D-Chip Stacking Packaging-Reference-Cited by-同舟云学术

Microstructure and Shear properties of Sn–xZn Transient Liquid Phase Bonding in 3D-Chip Stacking Packaging

Author:

Liu Zheng,Wang Xiang Yu^ORCID,Yang Li,Sun Lian Bei,Jiao Xi Xuan,Gao Hui Ming,Zhang Zhi Tao,Zhang Yao Cheng

Funder

National Natural Science Foundation of China

Natural Science Foundation of Guangxi Province

Middle-aged and Young Teachers' Basic Ability Promotion Project of Guangxi

Publisher

Springer Science and Business Media LLC

Subject

General Arts and Humanities

Link

Reference31 articles.

1. Shao H K, Wu A P, Bao Y D, Zhao Y, Zou G S, and Liu L, Mater. Character. 469 (2018) 144.

2. Dele-Afolabi T T, Azmah Hanim M A, Norkhairunnisa M, Yusoff H M, and Suraya M T, J. Alloys Compds. 368 (2015) 649.

3. Kannojia H K, and Dixit P, J. Mater. Res.-Mater. Electron. 6742 (2021) 32.

4. Zhang L, Liu Z, Chen S, Wang Y, Long W, Guo Y, Wang S, Ye G, and Liu W, J. Alloys Compds. 980 (2018) 750.

5. Zhu Z X, Li C C, Liao L L, Liu C K, and Kao C R, J. Alloys Compd. 340 (2016) 671.

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