Benefits of energetic ion bombardment for tailoring stress and microstructural evolution during growth of Cu thin films-Reference-Cited by-同舟云学术

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Benefits of energetic ion bombardment for tailoring stress and microstructural evolution during growth of Cu thin films

Published:2017-12 Issue: Volume:141 Page:120-130
ISSN:1359-6454
Container-title:Acta Materialia
language:en
Short-container-title:Acta Materialia

Author:

Cemin Felipe^ORCID,Abadias Gregory,Minea Tiberiu,Furgeaud Clarisse,Brisset François,Solas Denis,Lundin Daniel^ORCID

Funder

French National Center for Scientific Research

Brazilian National Council of Scientific and Technological Development

CNPq

LabeX INTERACTIFS

LabeX LaSIPS

"Nouvelle Aquitaine" Region

European Structural and Investment Funds

Publisher

Elsevier BV

Subject

Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials

Reference69 articles.

1. Stresses and deformation processes in thin films on substrates;Doerner;Crit. Rev. Solid State Mater. Sci.,1988

2. The intrinsic stress of polycrystalline and epitaxial thin metal films;Koch;J. Phys. Cond. Matter,1994

3. Stress in evaporated and sputtered thin films – a comparison;Koch;Surf. Coat. Technol.,2010

4. A simple model for the formation of compressive stress in thin films by ion bombardment;Davis;Thin Solid Films,1993

5. Peening in ion-assisted thin-film deposition: a generalized model;Carter;J. Phys. D. Appl. Phys.,1994

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