Author:
Doerner Mary F.,Nix William D.
Subject
Electrical and Electronic Engineering,Physical and Theoretical Chemistry,Condensed Matter Physics,General Chemical Engineering,Electronic, Optical and Magnetic Materials
Reference132 articles.
1. Elastic modulus in composition‐modulated copper‐nickel foils
2. Hoffman, R. W., Andeen, C. G. and Hagerling, C. W. 1977.Proc. 7th Int. Vac. Congr.Vol. 2, 1769Vienna
3. Campbell, D. S. 1970.Handbook of Thin Film Technology, Edited by: Maissel, L. I. and Glang, R. 123New York: McGraw-Hill.
4. Kinosita, K. 1968.Proc. 2nd Coll. on Thin Films, Edited by: Hahn, E. 3lGottingen: Vandenhoeck and Ruprecht.
5. The construction and use of thin film thermocouples for the measurement of surface temperature: Applications to substrate temperature determination and thermal bending of a cantilevered plate during film deposition
Cited by
574 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献