Ni silicide study at the atomic scale: Diffusing species, relaxation and grooving mechanisms
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference42 articles.
1. Silicides and local interconnections for high-performance VLSI applications
2. Compatibility of NiSi in the self-aligned suicide process for deep submicrometer devices
3. Formation and morphological stability of NiSi in the presence of W, Ti, and Ta alloying elements
4. Effect of Co, Pt, and Au additions on the stability and epitaxy of NiSi2 films on (111)Si
5. Enhancement of thermal stability of NiSi films on (100)Si and (111)Si by Pt addition
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