Effects of anisotropic β-Sn alloys on Cu diffusion under a temperature gradient
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference32 articles.
1. Thermomigration in Pb–Sn solder joints under joule heating during electric current stressing
2. Thermomigration in SnPb composite flip chip solder joints
3. Effect of entropy production on microstructure change in eutectic SnPb flip chip solder joints by thermomigration
4. In situ observation of thermomigration of Sn atoms to the hot end of 96.5Sn-3Ag-0.5Cu flip chip solder joints
5. Infrared microscopy of hot spots induced by Joule heating in flip-chip SnAg solder joints under accelerated electromigration
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2. Combined effect of Ag element and temperature gradient on the formation of highly orientated Sn grains in micro solder joints;Journal of Materials Research and Technology;2024-07
3. Current-induced solder evolution and mechanical property of Sn-3.0Ag-0.5Cu solder joints under thermal shock condition;Journal of Alloys and Compounds;2024-01
4. Inhibition of roof-type Cu6Sn5 grains on migration of Cu atoms under temperature gradient;Journal of Materials Science;2023-12-27
5. Study on Microstructure and Mechanical Properties at Constant Electromigration Temperature of Sn2.5Ag0.7Cu0.1RE0.05Ni-GNSs/Cu Solder Joints;Materials;2023-03-26
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