In situ observation of thermomigration of Sn atoms to the hot end of 96.5Sn-3Ag-0.5Cu flip chip solder joints
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.3671404
Reference24 articles.
1. Near-infrared semiconductor subwavelength-wire lasers
2. Effect of Al-trace dimension on Joule heating and current crowding in flip-chip solder joints under accelerated electromigration
3. Electrothermal coupling analysis of current crowding and Joule heating in flip-chip packages
4. Calibration of electromigration reliability of flip-chip packages by electrothermal coupling analysis
5. Reliability challenges in 3D IC packaging technology
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1. To suppress thermomigration of Cu–Sn intermetallic compounds in flip-chip solder joints;Journal of Materials Research and Technology;2023-05
2. Coupling model of electromigration and experimental verification – Part I: Effect of atomic concentration gradient;Journal of the Mechanics and Physics of Solids;2023-05
3. Characterization of Sn-xIn Solders and Thermomigration-Induced Interfacial IMC Growth of Cu/Sn-xIn/Cu Micro Solder Joints;Electronics;2023-04-18
4. Microstructural Evolution and Deterioration of Shear Properties of Sn3.0Ag0.5Cu/Cu Solder Joints after Long-Term Storage at Cryogenic Temperatures;Crystals;2023-03-29
5. Finite element method modeling of temperature gradient-induced Cu atomic thermomigration in Cu/Sn/Cu micro solder joint;Microelectronics Reliability;2022-02
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