Influence of Indium addition on microstructural and mechanical behavior of Sn solder alloys: Experiments and first principles calculations
Author:
Funder
National Science Foundation
Publisher
Elsevier BV
Subject
Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference46 articles.
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5. The influence of Ni and Zn additions on microstructure and phase transformations in Sn-0.7Cu/Cu solder joints;Zeng;Acta Mater.,2015
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