Review of Packaging of Optoelectronic, Photonic, and MEMS Components-Reference-Cited by-同舟云学术

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Review of Packaging of Optoelectronic, Photonic, and MEMS Components

Published:2011-05 Issue:3 Volume:17 Page:704-719
ISSN:1077-260X
Container-title:IEEE Journal of Selected Topics in Quantum Electronics
language:
Short-container-title:IEEE J. Select. Topics Quantum Electron.

Author:

Tekin Tolga

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Atomic and Molecular Physics, and Optics

Link

http://xplorestaging.ieee.org/ielx5/2944/5784182/05740939.pdf?arnumber=5740939

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