Microstructure control of unidirectional growth of η-Cu6Sn5 in microbumps on 〈111〉 oriented and nanotwinned Cu-Reference-Cited by-同舟云学术

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Microstructure control of unidirectional growth of η-Cu6Sn5 in microbumps on 〈111〉 oriented and nanotwinned Cu

Published:2013-08 Issue:13 Volume:61 Page:4910-4919
ISSN:1359-6454
Container-title:Acta Materialia
language:en
Short-container-title:Acta Materialia

Author:

Lin Han-wen,Lu Chia-ling,Liu Chien-min,Chen Chih,Chen Delphic,Kuo Jui-Chao,Tu K.N.

Publisher

Elsevier BV

Subject

Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials

Reference16 articles.

1. Dramatic morphological change of scallop-type Cu6Sn5 formed on (001) single crystal copper in reaction between molten SnPb solder and Cu

2. Preferred orientation relationship between Cu6Sn5 scallop-type grains and Cu substrate in reactions between molten Sn-based solders and Cu

3. Morphologies, orientation relationships and evolution of Cu6Sn5 grains formed between molten Sn and Cu single crystals

4. A study on the orientation relationship between the scallop-type Cu6Sn5 grains and (011) Cu substrate using electron backscattered diffraction

5. Microstructural analysis of lead-free solder alloys

Cited by 43 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Bonding Behavior and Quality of Pressureless Ag Sintering on (111)-Oriented Nanotwinned Cu Substrate in Ambient Air;Materials;2024-09-09

2. Evolution mechanism of interfacial multi-layer intermetallic compounds and failure behavior in the Al–Au wire bonding;Journal of Materials Research and Technology;2024-09

3. Thermal and compositional fields to maneuver Cu6Sn5 intermetallic growth on (111) nanotwinned copper substrate;Journal of Alloys and Compounds;2024-09

4. Excellent Oxidation Resistance and Solder Wettability of (111)-Oriented Nanotwinned Cu;ACTA METALL SIN;2024

5. Role of Cu microstructure during isothermal aging of Cu/Sn/Cu micro solder joints;Journal of Materials Science;2024-04-13

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