A study on the orientation relationship between the scallop-type Cu6Sn5 grains and (011) Cu substrate using electron backscattered diffraction
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.3266144
Reference13 articles.
1. Lead-free Solders in Microelectronics
2. Interfacial reactions between lead-free solders and common base materials
3. Effect of Zn Addition on Interfacial Reactions Between Sn-4Ag Solder and Ag Substrates
4. Six cases of reliability study of Pb-free solder joints in electronic packaging technology
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1. Formation mechanism and reliability of preferred growth full Cu6Sn5 intermetallic compound interconnect on (011) Cu single-crystal substrate;Journal of Materials Science: Materials in Electronics;2022-10-17
2. Domain structure of pseudosymmetric η″-ordered Cu6Sn5 by EBSD analysis;Acta Materialia;2022-05
3. Interfacial reactions at Ga-21.5In–10Sn/Cu liquid-solid interfaces under isothermal and non-isothermal conditions;Materials Chemistry and Physics;2022-04
4. Morphology and orientation evolution of Cu6Sn5 grains on (001)Cu and (011)Cu single crystal substrates under temperature gradient;Journal of Materials Science & Technology;2021-12
5. Strategies for inducing heredity of β-Sn texture in micro solder joints during multi-reflow process;Materials & Design;2021-06
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