Formation mechanism and reliability of preferred growth full Cu6Sn5 intermetallic compound interconnect on (011) Cu single-crystal substrate-Reference-Cited by-同舟云学术

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Formation mechanism and reliability of preferred growth full Cu6Sn5 intermetallic compound interconnect on (011) Cu single-crystal substrate

Published:2022-10-17 Issue:33 Volume:33 Page:25274-25284
ISSN:0957-4522
Container-title:Journal of Materials Science: Materials in Electronics
language:en
Short-container-title:J Mater Sci: Mater Electron

Author:

Huang M. L.^ORCID,Zou L.,Wu Y.

Funder

National Natural Science Foundation of China

Fundamental Research Funds for the Central Universities

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Link

https://link.springer.com/content/pdf/10.1007/s10854-022-09234-1.pdf

Reference25 articles.

1. H.Y. Hsiao, C.M. Liu, H.W. Lin, T.C. Liu, C.L. Lu, Y.S. Huang, C. Chen, K.N. Tu, Unidirectional growth of microbumps on (111)-oriented and nanotwinned copper. Science 336, 1007–1010 (2012)

2. Z.H. Zhang, M.Y. Li, Z.Q. Liu, S.H. Yang, Growth characteristics and formation mechanisms of Cu6Sn5 phase at the liquid-Sn0.7Cu/(111)Cu and liquid-Sn0.7Cu/(001)Cu joint interfaces. Acta Mater. 104, 1–8 (2016)

3. H.F. Zou, H.J. Yang, Z.F. Zhang, Morphologies, orientation relationships and evolution of Cu6Sn5 grains formed between molten Sn and Cu single crystals. Acta Mater. 56(11), 2649–2662 (2008)

4. J.O. Suh, K.N. Tu, N. Tamura, Dramatic morphological change of scallop-type Cu6Sn5 formed on (001) single crystal copper in reaction between molten SnPb solder and Cu. Appl. Phys. Lett. 91(5), 051907 (2007)

5. Z.H. Zhang, H. Cao, M. Li, Y. Yu, H. Yang, S. Yang, Three-dimensional placement rules of Cu6Sn5 textures formed on the (111) Cu and (001) Cu surfaces using electron backscattered diffraction. Mater. Des. 94, 280–285 (2016)

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