Three-dimensional placement rules of Cu6Sn5 textures formed on the (111)Cu and (001)Cu surfaces using electron backscattered diffraction-Reference-Cited by-同舟云学术

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Three-dimensional placement rules of Cu6Sn5 textures formed on the (111)Cu and (001)Cu surfaces using electron backscattered diffraction

Published:2016-03 Issue: Volume:94 Page:280-285
ISSN:0264-1275
Container-title:Materials & Design
language:en
Short-container-title:Materials & Design

Author:

Zhang Zhihao,Cao Huijun,Li Mingyu,Yu Yuxi,Yang Haifeng,Yang Shihua

Funder

National Nature Science Foundation of China

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference21 articles.

1. Size effect model on kinetics of interfacial reaction between Sn–xAg–yCu solders and Cu substrate;Huang;Sci. Rep.,2014

2. The effect of crystallographic orientation on the mechanical behavior of Cu6Sn5 by micropillar compression testing;Jiang;J. Electron. Mater.,2012

3. Epitaxial Cu–Sn bulk crystals grown by electric current;Liu;Acta Mater.,2013

4. Unidirectional growth of microbumps on (111)-oriented and nanotwinned copper;Hsiao;Science,2012

5. Epitaxial growth of Cu6Sn5 formed at Sn-based lead-free solder/non-textured polycrystalline Cu plate interface;Tsukamoto;Mater. Lett.,2009

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2. Tuning the growth of intermetallic compounds at Sn-0.7Cu solder/Cu substrate interface by adding small amounts of indium;Journal of Materials Science & Technology;2024-05

3. Nucleation and growth of Cu6Sn5 during the aging process of Cu/Sn interface in electronic packaging-by in-situ TEM;Acta Materialia;2024-01

4. Study on Cu6Sn5 morphology and grain orientation transition at the interface of (111) nt-Cu and liquid Sn;Journal of Materials Research and Technology;2023-09

5. Nucleation and growth of intermetallic compounds on the prefabricated Cu6Sn5 layer;Materials Chemistry and Physics;2023-02

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