Microstructural analysis of lead-free solder alloys-Reference-Cited by-同舟云学术

Microstructural analysis of lead-free solder alloys

Published:2006-08 Issue:8 Volume:37 Page:2505-2514
ISSN:1073-5623
Container-title:Metallurgical and Materials Transactions A
language:en
Short-container-title:Metall and Mat Trans A

Author:

Kumar Vineet,Fang Zhigang Zak,Liang Jin,Dariavach Nader

Publisher

Springer Science and Business Media LLC

Subject

Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Link

http://link.springer.com/content/pdf/10.1007/BF02586223.pdf

Reference24 articles.

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2. U.S. Patent 5,527,628.

3. M.E. Loonans and M.E. Fine:Metall. Mater. Trans. A, 2000, vol. 31A, pp. 1155–62.

4. K.-W. Moon, W.J. Boettinger, U.R. Kattner, F.S. Biancaniello, and C.A. Handwerker:J. Electron. Mater., 2000, vol. 29, pp. 1122–236.

5. A. Grusd:Circ. Assembly, 1999, August, pp. 32–38.

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